All Integrated Circuits (ICs) and Transistors are available in one or more standard packages.
Type of packages:
DIP / DIL = Dual In Line Package. Mostly through hole type package used to put on one side of the PCB ( Printed Circuit Board ) and solder on the opposite side of the PCB.
SIL / SIP = Single In Line Package.
PDIP = Plastic Dual In Line Package.
CDIP = Ceramic Dual In Line Package.
SO / SOIC / SOP : Small-Outline Integrated Circuit
QIP / QIL = Quadraple In Line Package.
SMT = Surface Mount Technology package. The IC is placed on the PCB and solder on the track of same side of the PCB. SOJ , SOIC , LQFP, QFN, MLF, QFP, MQFP are some variants of SMT ICs, having various types pin outs.
LQFP = Low-profile Quad Flat-Package is SMT IC.
TQFP = Thin Quad Flat-Package (having leads) is SMT IC.
TQFN = Thin Quad Flat No-lead
PLCC = Plastic Leaded Chip-Carrier
CLCC = Ceramic Leadless Chip-Carrier
QFN/MLF = Quad flat No-leads package. Also called as Micro Lead Frame.
QFP = Quad Flat Package.
MQFP = Metric Quad Flat Package.
TO-220 = Through-hole plastic package with three leads attached with a metal heat sink tab with hole on top.
SOT-23 / SOT-223 = Small Outline Transistor Package is SMT IC, having three pin-outs.